Funder
HORIZON-Chips-2023-RIA-CPL – call for proposals for set-up, integration and process development
Added date
07/12/2023
Closing date
29/02/2024
Call summary
This call supports projects aimed at strengthening Europe's semiconductor ecosystem and economic security. The following topics are available:
HORIZON-Chips-2023-RIA-CPL-1 - Pilot line on advanced sub 2nm leading-edge system on chip technology;
HORIZON-Chips-2023-RIA-CPL2 - Pilot line on advanced Fully Depleted Silicon On Insulator technologies targeting 7nm;
HORIZON-Chips-2023-RIA-CPL-3 - Pilot line on advanced Packaging and Heterogenous Integration;
HORIZON-Chips-2023-RIA-CPL-4 - Pilot line on advanced semiconductor devices based on Wide Bandgap materials.
Amount note The total budget is €1.16 billion to fund one project for each topic.
Scientific scope
Computer Engineering & Hardware; Manufacturing & Industrial Engineering; Materials Sciences; Mobile Devices, Apps & Ecosystems
PI eligibility
Country of applicant institution Horizon 2020 Associated States; Horizon 2020 Member States
Nationality of researcher Unspecified
Applicant type Academic Institution; Commercial or Private Sector; Government or Public Sector
Career stages Not Applicable
Eligibility Note Research and technology organisations that wish to establish pilot lines in EU member states are eligible.